Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure s...
Saved in:
| Main Authors: | , |
|---|---|
| 格式: | Article |
| 語言: | English |
| 出版: |
IOP Publishing
2015
|
| 主題: | |
| 在線閱讀: | http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf http://eprints.intimal.edu.my/234/ http://dx.doi.org/10.1088/1757-899X/88/1/012043 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 總結: | This paper is aimed at studying the thermal distribution and its associated effects on
a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated
using Finite-Element Method with the help of a FEM software (Ansys Workbench 14).
Physical changes of the structure such as temperature change and deformation are measured
and are used as the basis for comparison between models of heat sinks. This paper also
attempts to study the effect of thermal loading on the materials found in a heat sink hardware in
terms of stresses that may arise due to physical restraints in the hardware as well as provide an
optimized solution to reduce its form factor in order to be comparable to an Ultrabook class
heat-sink. An optimized solution is made based on a cylindrical fin concept. |
|---|