Etching performance of silicon wafers with redesigned etching drum

Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. This master project addresses the major problem on wafers during etching that is wafer removal distribution throughout etching drum compartment. The etching drum has been redesigned to overcome t...

詳細記述

保存先:
書誌詳細
第一著者: Dolah, Rozzeta
フォーマット: 学位論文
言語:English
出版事項: 2006
主題:
オンライン・アクセス:http://eprints.utm.my/id/eprint/9445/1/RozzetaDolahFKM2005.pdf
http://eprints.utm.my/id/eprint/9445/
http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:690?site_name=Restricted Repository
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