Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
A microwave dielectric spectroscopy for detecting adhesive disbonds between acrylic glass (aka Poly (methyl methacrylate)) was discussed. The adhesive bond was developed using epoxy resin and acrylate. The level of joint disbond can be quantified using Young Modulus. In this work, the strength of bo...
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| 主要な著者: | , , , , , , , , , , |
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| フォーマット: | 論文 |
| 出版事項: |
Asian Research Publishing Network
2020
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| 主題: | |
| オンライン･アクセス: | http://eprints.utm.my/id/eprint/93098/ http://www.arpnjournals.com/jeas/volume_19_2020.htm |
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