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Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band

A microwave dielectric spectroscopy for detecting adhesive disbonds between acrylic glass (aka Poly (methyl methacrylate)) was discussed. The adhesive bond was developed using epoxy resin and acrylate. The level of joint disbond can be quantified using Young Modulus. In this work, the strength of bo...

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Main Authors: Cheng, E. M., Mohd. Afendi, R., Shahriman, A. B., Razlan, Z. M., You, K. Y., Nashrul Fazli, M. N., Mohd. Shukry, A. M., Khairul Salleh, B., Ridzuan, M. J. M., Beh, C. Y., Khor, S. F.
Format: Article
Published: Asian Research Publishing Network 2020
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/id/eprint/93098/
http://www.arpnjournals.com/jeas/volume_19_2020.htm
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spelling my.utm.930982021-11-07T05:59:58Z http://eprints.utm.my/id/eprint/93098/ Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band Cheng, E. M. Mohd. Afendi, R. Shahriman, A. B. Razlan, Z. M. You, K. Y. Nashrul Fazli, M. N. Mohd. Shukry, A. M. Khairul Salleh, B. Ridzuan, M. J. M. Beh, C. Y. Khor, S. F. TK Electrical engineering. Electronics Nuclear engineering A microwave dielectric spectroscopy for detecting adhesive disbonds between acrylic glass (aka Poly (methyl methacrylate)) was discussed. The adhesive bond was developed using epoxy resin and acrylate. The level of joint disbond can be quantified using Young Modulus. In this work, the strength of bond is affected by radius of air void within adhesive bond. A high-frequency electromagnetic wave propagated through two joint acrylic glass with acrylate and epoxy adhesive using waveguide adaptor WR90 in conjunction with professional network analyser. This electromagnetic wave is reflected and transmitted at the bond interface due to mismatch impedance at adhesive bond. The output is a dielectric properties that characterizes the bond interface. The increment of Young Modulus leads to increment of dielectric constant and loss factor for epoxy resin and acrylates, respectively. Asian Research Publishing Network 2020 Article PeerReviewed Cheng, E. M. and Mohd. Afendi, R. and Shahriman, A. B. and Razlan, Z. M. and You, K. Y. and Nashrul Fazli, M. N. and Mohd. Shukry, A. M. and Khairul Salleh, B. and Ridzuan, M. J. M. and Beh, C. Y. and Khor, S. F. (2020) Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band. ARPN Journal of Engineering and Applied Sciences, 15 (19). pp. 2153-2160. ISSN 1819-6608 http://www.arpnjournals.com/jeas/volume_19_2020.htm
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Cheng, E. M.
Mohd. Afendi, R.
Shahriman, A. B.
Razlan, Z. M.
You, K. Y.
Nashrul Fazli, M. N.
Mohd. Shukry, A. M.
Khairul Salleh, B.
Ridzuan, M. J. M.
Beh, C. Y.
Khor, S. F.
Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
description A microwave dielectric spectroscopy for detecting adhesive disbonds between acrylic glass (aka Poly (methyl methacrylate)) was discussed. The adhesive bond was developed using epoxy resin and acrylate. The level of joint disbond can be quantified using Young Modulus. In this work, the strength of bond is affected by radius of air void within adhesive bond. A high-frequency electromagnetic wave propagated through two joint acrylic glass with acrylate and epoxy adhesive using waveguide adaptor WR90 in conjunction with professional network analyser. This electromagnetic wave is reflected and transmitted at the bond interface due to mismatch impedance at adhesive bond. The output is a dielectric properties that characterizes the bond interface. The increment of Young Modulus leads to increment of dielectric constant and loss factor for epoxy resin and acrylates, respectively.
format Article
author Cheng, E. M.
Mohd. Afendi, R.
Shahriman, A. B.
Razlan, Z. M.
You, K. Y.
Nashrul Fazli, M. N.
Mohd. Shukry, A. M.
Khairul Salleh, B.
Ridzuan, M. J. M.
Beh, C. Y.
Khor, S. F.
author_facet Cheng, E. M.
Mohd. Afendi, R.
Shahriman, A. B.
Razlan, Z. M.
You, K. Y.
Nashrul Fazli, M. N.
Mohd. Shukry, A. M.
Khairul Salleh, B.
Ridzuan, M. J. M.
Beh, C. Y.
Khor, S. F.
author_sort Cheng, E. M.
title Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
title_short Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
title_full Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
title_fullStr Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
title_full_unstemmed Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
title_sort microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at ku-band
publisher Asian Research Publishing Network
publishDate 2020
url http://eprints.utm.my/id/eprint/93098/
http://www.arpnjournals.com/jeas/volume_19_2020.htm
_version_ 1717093419724046336
score 13.211869

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