Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band
A microwave dielectric spectroscopy for detecting adhesive disbonds between acrylic glass (aka Poly (methyl methacrylate)) was discussed. The adhesive bond was developed using epoxy resin and acrylate. The level of joint disbond can be quantified using Young Modulus. In this work, the strength of bo...
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| Main Authors: | , , , , , , , , , , |
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| 格式: | Article |
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Asian Research Publishing Network
2020
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| 在線閱讀: | http://eprints.utm.my/id/eprint/93098/ http://www.arpnjournals.com/jeas/volume_19_2020.htm |
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