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Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization

The demand for using high-performance Cu matrix composites in the electronic industry has recently increased rapidly owing to the low strength and tribological properties of pure copper. Accordingly, research and development of composite processing and related properties have increased. In this stud...

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Main Authors:	Bahador, Abdollah, Junko, Umeda, Yamanoglu, Ridvan, Ghandvar, Hamidreza, Issariyapat, Ammarueda, Abu Bakar, Tuty Asma, Katsuyoshi, Kondoh
Format:	Article
Published:	Elsevier Ltd 2020
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/91367/ http://dx.doi.org/10.1016/j.jallcom.2020.156555
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spelling	my.utm.913672021-06-30T12:08:20Z http://eprints.utm.my/id/eprint/91367/ Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization Bahador, Abdollah Junko, Umeda Yamanoglu, Ridvan Ghandvar, Hamidreza Issariyapat, Ammarueda Abu Bakar, Tuty Asma Katsuyoshi, Kondoh TJ Mechanical engineering and machinery The demand for using high-performance Cu matrix composites in the electronic industry has recently increased rapidly owing to the low strength and tribological properties of pure copper. Accordingly, research and development of composite processing and related properties have increased. In this study, the Cu matrix was reinforced with different amounts of TiB2 particles by mechanical alloying of elemental powders followed by consolidation employing spark plasma sintering (SPS) whereby high relative density (∼99%) and electric conductivity (∼83–88% IACS) were obtained. Tensile properties and deformation mechanisms of the composites were studied utilizing conventional and in-situ tensile tests with simultaneous FESEM and EBSD observations. In comparison with the reference pure copper, it was found that adding 0.5 wt%TiB2 results in significant ductility increment, which was consistent with the longer strain-softening behavior observed after necking. In addition, using in-situ microstructure characterization, twinning with slip bands were confirmed as deformation mechanisms. By increasing the amount of reinforcement to 5 wt%TiB2, strengthening was remarkable while sustaining a considerable elongation. The Hall-Petch and dislocation strengthening mechanisms were the key models of strengthening based on the calculations and microstructure characterizations since by increasing the TiB2 particles, significant grain refinement and dislocation density were shown. Elsevier Ltd 2020-12 Article PeerReviewed Bahador, Abdollah and Junko, Umeda and Yamanoglu, Ridvan and Ghandvar, Hamidreza and Issariyapat, Ammarueda and Abu Bakar, Tuty Asma and Katsuyoshi, Kondoh (2020) Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization. Journal of Alloys and Compounds, 847 . p. 156555. ISSN 0925-8388 http://dx.doi.org/10.1016/j.jallcom.2020.156555
institution	Universiti Teknologi Malaysia
building	UTM Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Teknologi Malaysia
content_source	UTM Institutional Repository
url_provider	http://eprints.utm.my/
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Bahador, Abdollah Junko, Umeda Yamanoglu, Ridvan Ghandvar, Hamidreza Issariyapat, Ammarueda Abu Bakar, Tuty Asma Katsuyoshi, Kondoh Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
description	The demand for using high-performance Cu matrix composites in the electronic industry has recently increased rapidly owing to the low strength and tribological properties of pure copper. Accordingly, research and development of composite processing and related properties have increased. In this study, the Cu matrix was reinforced with different amounts of TiB2 particles by mechanical alloying of elemental powders followed by consolidation employing spark plasma sintering (SPS) whereby high relative density (∼99%) and electric conductivity (∼83–88% IACS) were obtained. Tensile properties and deformation mechanisms of the composites were studied utilizing conventional and in-situ tensile tests with simultaneous FESEM and EBSD observations. In comparison with the reference pure copper, it was found that adding 0.5 wt%TiB2 results in significant ductility increment, which was consistent with the longer strain-softening behavior observed after necking. In addition, using in-situ microstructure characterization, twinning with slip bands were confirmed as deformation mechanisms. By increasing the amount of reinforcement to 5 wt%TiB2, strengthening was remarkable while sustaining a considerable elongation. The Hall-Petch and dislocation strengthening mechanisms were the key models of strengthening based on the calculations and microstructure characterizations since by increasing the TiB2 particles, significant grain refinement and dislocation density were shown.
format	Article
author	Bahador, Abdollah Junko, Umeda Yamanoglu, Ridvan Ghandvar, Hamidreza Issariyapat, Ammarueda Abu Bakar, Tuty Asma Katsuyoshi, Kondoh
author_facet	Bahador, Abdollah Junko, Umeda Yamanoglu, Ridvan Ghandvar, Hamidreza Issariyapat, Ammarueda Abu Bakar, Tuty Asma Katsuyoshi, Kondoh
author_sort	Bahador, Abdollah
title	Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
title_short	Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
title_full	Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
title_fullStr	Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
title_full_unstemmed	Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
title_sort	deformation mechanism and enhanced properties of cu–tib2 composites evaluated by the in-situ tensile test and microstructure characterization
publisher	Elsevier Ltd
publishDate	2020
url	http://eprints.utm.my/id/eprint/91367/ http://dx.doi.org/10.1016/j.jallcom.2020.156555
_version_	1705056703448350720
score	13.211869

Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization

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