Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization
The demand for using high-performance Cu matrix composites in the electronic industry has recently increased rapidly owing to the low strength and tribological properties of pure copper. Accordingly, research and development of composite processing and related properties have increased. In this stud...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Published: |
Elsevier Ltd
2020
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/91367/ http://dx.doi.org/10.1016/j.jallcom.2020.156555 |
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