Numerical simulation of a microchip cooling wth microjet array
The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm2, the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a pot...
Saved in:
| Main Authors: | , |
|---|---|
| 格式: | Article |
| 語言: | English |
| 出版: |
Faculty of Mechanical Engineering
2008
|
| 主題: | |
| 在線閱讀: | http://eprints.utm.my/id/eprint/8735/3/YeoEngSoon2008_NumericalSimulationofaMicrochipCooling.pdf http://eprints.utm.my/id/eprint/8735/ |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|