Cover Image

Numerical simulation of a microchip cooling wth microjet array

The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm2, the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a pot...

Full description

Saved in:
Bibliographic Details
Main Authors: Yeo, Eng Soon, Mohd. Ghazali, Normah
Format: Article
Language:English
Published: Faculty of Mechanical Engineering 2008
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/8735/3/YeoEngSoon2008_NumericalSimulationofaMicrochipCooling.pdf
http://eprints.utm.my/id/eprint/8735/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utm.8735
record_format eprints
spelling my.utm.87352017-02-21T06:52:14Z http://eprints.utm.my/id/eprint/8735/ Numerical simulation of a microchip cooling wth microjet array Yeo, Eng Soon Mohd. Ghazali, Normah TJ Mechanical engineering and machinery The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm2, the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a potential solution for the thermal management of these high performance microchips. This study looks into the numerical simulation of microjet arrays impinging with nozzle diameter ranging from 40 ?m to 76 ?m. Simulation results show the ability of a single-jet with 76 ?m diameter nozzle in cooling the microchip dissipating 4.3 Watts of heat flux over a 1 cm² area. For multiple jets array, simulation results show that it is capable of achieving very low average surface temperature. It has also identified the problem associated with the increased number of jets due to the cross flow between the jets. It is found that multiple jets have better performance than the single jet even though the flowrate per jet is much lower. Faculty of Mechanical Engineering 2008-06 Article PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/8735/3/YeoEngSoon2008_NumericalSimulationofaMicrochipCooling.pdf Yeo, Eng Soon and Mohd. Ghazali, Normah (2008) Numerical simulation of a microchip cooling wth microjet array. Jurnal Mekanikal (25). pp. 39-49. ISSN 0127-3396
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Yeo, Eng Soon
Mohd. Ghazali, Normah
Numerical simulation of a microchip cooling wth microjet array
description The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm2, the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a potential solution for the thermal management of these high performance microchips. This study looks into the numerical simulation of microjet arrays impinging with nozzle diameter ranging from 40 ?m to 76 ?m. Simulation results show the ability of a single-jet with 76 ?m diameter nozzle in cooling the microchip dissipating 4.3 Watts of heat flux over a 1 cm² area. For multiple jets array, simulation results show that it is capable of achieving very low average surface temperature. It has also identified the problem associated with the increased number of jets due to the cross flow between the jets. It is found that multiple jets have better performance than the single jet even though the flowrate per jet is much lower.
format Article
author Yeo, Eng Soon
Mohd. Ghazali, Normah
author_facet Yeo, Eng Soon
Mohd. Ghazali, Normah
author_sort Yeo, Eng Soon
title Numerical simulation of a microchip cooling wth microjet array
title_short Numerical simulation of a microchip cooling wth microjet array
title_full Numerical simulation of a microchip cooling wth microjet array
title_fullStr Numerical simulation of a microchip cooling wth microjet array
title_full_unstemmed Numerical simulation of a microchip cooling wth microjet array
title_sort numerical simulation of a microchip cooling wth microjet array
publisher Faculty of Mechanical Engineering
publishDate 2008
url http://eprints.utm.my/id/eprint/8735/3/YeoEngSoon2008_NumericalSimulationofaMicrochipCooling.pdf
http://eprints.utm.my/id/eprint/8735/
_version_ 1643645058750087168
score 13.211869

Similar Items