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Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics

The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic...

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Main Author: Ab. Majid, Nurul Kausar
Format: Thesis
Language:English
Published: 2018
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/id/eprint/78958/1/NurulKausarAbMajidMFKE2018.pdf
http://eprints.utm.my/id/eprint/78958/
http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666
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spelling my.utm.789582018-09-19T05:13:06Z http://eprints.utm.my/id/eprint/78958/ Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics Ab. Majid, Nurul Kausar TK Electrical engineering. Electronics Nuclear engineering The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic product, performance, and the reliability. This project presents the 3D simulation of the optimal thermal profile of component placement on Printed Circuit Board (PCB) using COMSOL Multiphysics software package. The simulation was carried out for various model of component arrangement on (PCB). The objectives are to find an optimum component arrangement with minimal heat dissipation and smaller area of PCB. Nelder-Mead Optimization tools have been used to solve the multi-objective problems. The result shows that with the proper arrangement, the area of PCB able reduces up to 26% while the temperature of components able to reduce up to 40%. Therefore, this research will significantly benefit for the case of thermal performance improvement onto the electronic product and package size. 2018-01 Thesis NonPeerReviewed application/pdf en http://eprints.utm.my/id/eprint/78958/1/NurulKausarAbMajidMFKE2018.pdf Ab. Majid, Nurul Kausar (2018) Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics. Masters thesis, Universiti Teknologi Malaysia, Faculty of Electrical Engineering. http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Ab. Majid, Nurul Kausar
Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
description The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic product, performance, and the reliability. This project presents the 3D simulation of the optimal thermal profile of component placement on Printed Circuit Board (PCB) using COMSOL Multiphysics software package. The simulation was carried out for various model of component arrangement on (PCB). The objectives are to find an optimum component arrangement with minimal heat dissipation and smaller area of PCB. Nelder-Mead Optimization tools have been used to solve the multi-objective problems. The result shows that with the proper arrangement, the area of PCB able reduces up to 26% while the temperature of components able to reduce up to 40%. Therefore, this research will significantly benefit for the case of thermal performance improvement onto the electronic product and package size.
format Thesis
author Ab. Majid, Nurul Kausar
author_facet Ab. Majid, Nurul Kausar
author_sort Ab. Majid, Nurul Kausar
title Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
title_short Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
title_full Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
title_fullStr Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
title_full_unstemmed Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
title_sort improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
publishDate 2018
url http://eprints.utm.my/id/eprint/78958/1/NurulKausarAbMajidMFKE2018.pdf
http://eprints.utm.my/id/eprint/78958/
http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666
_version_ 1643658056812199936
score 13.211869

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