Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic...
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| Format: | Thesis |
| Language: | English |
| Published: |
2018
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/78958/1/NurulKausarAbMajidMFKE2018.pdf http://eprints.utm.my/id/eprint/78958/ http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666 |
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| Summary: | The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic product, performance, and the reliability. This project presents the 3D simulation of the optimal thermal profile of component placement on Printed Circuit Board (PCB) using COMSOL Multiphysics software package. The simulation was carried out for various model of component arrangement on (PCB). The objectives are to find an optimum component arrangement with minimal heat dissipation and smaller area of PCB. Nelder-Mead Optimization tools have been used to solve the multi-objective problems. The result shows that with the proper arrangement, the area of PCB able reduces up to 26% while the temperature of components able to reduce up to 40%. Therefore, this research will significantly benefit for the case of thermal performance improvement onto the electronic product and package size. |
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