Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that ad...
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my.utm.526012018-06-26T07:59:35Z http://eprints.utm.my/id/eprint/52601/ Effects of friction modifier additives on HDD substrate defects and surface topography during CMP Sudin, Izman Salleh, Sideq TJ Mechanical engineering and machinery This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that addition of Friction Modifier Additives into the slurry reduces the overall coefficient of friction (CoF) during CMP process. By increasing the FMA concentration in the polishing slurry, the substrate surface topography such as waviness and surface roughness were improved significantly. It also lowered the defects counts especially scratch and sub-micron damage as revealed under Optical Surface Analyser (OSA) and Atomic Force Microscope (AFM) analysis. Trans Tech Publication 2014 Article PeerReviewed Sudin, Izman and Salleh, Sideq (2014) Effects of friction modifier additives on HDD substrate defects and surface topography during CMP. Advanced Materials Research, 845 . pp. 894-898. ISSN 1022-6680 http://dx.doi.org/10.4028/www.scientific.net/AMR.845.894 DOI:10.4028/www.scientific.net/AMR.845.894 |
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TJ Mechanical engineering and machinery Sudin, Izman Salleh, Sideq Effects of friction modifier additives on HDD substrate defects and surface topography during CMP |
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This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that addition of Friction Modifier Additives into the slurry reduces the overall coefficient of friction (CoF) during CMP process. By increasing the FMA concentration in the polishing slurry, the substrate surface topography such as waviness and surface roughness were improved significantly. It also lowered the defects counts especially scratch and sub-micron damage as revealed under Optical Surface Analyser (OSA) and Atomic Force Microscope (AFM) analysis. |
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Article |
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Sudin, Izman Salleh, Sideq |
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Sudin, Izman Salleh, Sideq |
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Sudin, Izman |
title |
Effects of friction modifier additives on HDD substrate defects and surface topography during CMP |
title_short |
Effects of friction modifier additives on HDD substrate defects and surface topography during CMP |
title_full |
Effects of friction modifier additives on HDD substrate defects and surface topography during CMP |
title_fullStr |
Effects of friction modifier additives on HDD substrate defects and surface topography during CMP |
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Effects of friction modifier additives on HDD substrate defects and surface topography during CMP |
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effects of friction modifier additives on hdd substrate defects and surface topography during cmp |
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Trans Tech Publication |
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2014 |
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http://eprints.utm.my/id/eprint/52601/ http://dx.doi.org/10.4028/www.scientific.net/AMR.845.894 |
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