Effects of friction modifier additives on HDD substrate defects and surface topography during CMP

This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that ad...

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Main Authors: Sudin, Izman, Salleh, Sideq
Format: Article
Published: Trans Tech Publication 2014
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Online Access:http://eprints.utm.my/id/eprint/52601/
http://dx.doi.org/10.4028/www.scientific.net/AMR.845.894
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spelling my.utm.526012018-06-26T07:59:35Z http://eprints.utm.my/id/eprint/52601/ Effects of friction modifier additives on HDD substrate defects and surface topography during CMP Sudin, Izman Salleh, Sideq TJ Mechanical engineering and machinery This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that addition of Friction Modifier Additives into the slurry reduces the overall coefficient of friction (CoF) during CMP process. By increasing the FMA concentration in the polishing slurry, the substrate surface topography such as waviness and surface roughness were improved significantly. It also lowered the defects counts especially scratch and sub-micron damage as revealed under Optical Surface Analyser (OSA) and Atomic Force Microscope (AFM) analysis. Trans Tech Publication 2014 Article PeerReviewed Sudin, Izman and Salleh, Sideq (2014) Effects of friction modifier additives on HDD substrate defects and surface topography during CMP. Advanced Materials Research, 845 . pp. 894-898. ISSN 1022-6680 http://dx.doi.org/10.4028/www.scientific.net/AMR.845.894 DOI:10.4028/www.scientific.net/AMR.845.894
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Sudin, Izman
Salleh, Sideq
Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
description This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that addition of Friction Modifier Additives into the slurry reduces the overall coefficient of friction (CoF) during CMP process. By increasing the FMA concentration in the polishing slurry, the substrate surface topography such as waviness and surface roughness were improved significantly. It also lowered the defects counts especially scratch and sub-micron damage as revealed under Optical Surface Analyser (OSA) and Atomic Force Microscope (AFM) analysis.
format Article
author Sudin, Izman
Salleh, Sideq
author_facet Sudin, Izman
Salleh, Sideq
author_sort Sudin, Izman
title Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
title_short Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
title_full Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
title_fullStr Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
title_full_unstemmed Effects of friction modifier additives on HDD substrate defects and surface topography during CMP
title_sort effects of friction modifier additives on hdd substrate defects and surface topography during cmp
publisher Trans Tech Publication
publishDate 2014
url http://eprints.utm.my/id/eprint/52601/
http://dx.doi.org/10.4028/www.scientific.net/AMR.845.894
_version_ 1643653205067825152
score 13.211869