Cover Image

Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue

This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arran...

Full description

Saved in:
Bibliographic Details
Main Authors: Tamin, M N, Liew, Y B
Format: Article
Language:English
Published: Universiti Kebangsaan Malaysia 2005
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/470/1/cem05-039_MNTamin__Ed_3.pdf
http://eprints.utm.my/id/eprint/470/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utm.470
record_format eprints
spelling my.utm.4702010-06-01T02:44:44Z http://eprints.utm.my/id/eprint/470/ Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue Tamin, M N Liew, Y B TJ Mechanical engineering and machinery This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arranged along the peripheral of a 24x24 solder array. The various different materials considered in the simulation are Si-die, 60Sn-40Pb solder alloy, Cu-traces, Cu6Sn5 intermetallics, FR-4 substrate and PCB. The temperature- and strain-rate-dependent plastic stressstrain curves define the viscoplastic response of the near-eutectic solder alloys. Orthotropic behavior of the FR-4 substrate and PCB is modeled. Other materials are assumed to behave elastically with temperature-dependent material properties. Temperature loading of the package consists of an initial cooling down from the re-flow temperature at 183 oC to 25 oC followed by thermal cycling between -40 to 125 oC. Results of the analysis show that the package warps with a magnitude of 93 µm at 25 oC after re-flow. In this process, the critical solder joint accumulated an inelastic strain of 0.856 percent. Faster temperature ramp rate at 370 oC/min (load case TR1) versus 33 oC/min (load case TC1) resulted in 12 percent lower inelastic strain after completing 3 temperature cycles. However, the inelastic strain magnitude is achieved in a much shorter time. The shear stressstrain hysteresis loops display the largest strain ranges compared to other stressstrain components. The calculated shear strain range is 0.8 percent with the corresponding stress range of 34.0 MPa. Universiti Kebangsaan Malaysia 2005-05-17 Article NonPeerReviewed application/pdf en http://eprints.utm.my/id/eprint/470/1/cem05-039_MNTamin__Ed_3.pdf Tamin, M N and Liew, Y B (2005) Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue. National Seminar on Computational & Experimental Mechanics (CEM) 2005 . pp. 351-360.
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Tamin, M N
Liew, Y B
Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
description This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arranged along the peripheral of a 24x24 solder array. The various different materials considered in the simulation are Si-die, 60Sn-40Pb solder alloy, Cu-traces, Cu6Sn5 intermetallics, FR-4 substrate and PCB. The temperature- and strain-rate-dependent plastic stressstrain curves define the viscoplastic response of the near-eutectic solder alloys. Orthotropic behavior of the FR-4 substrate and PCB is modeled. Other materials are assumed to behave elastically with temperature-dependent material properties. Temperature loading of the package consists of an initial cooling down from the re-flow temperature at 183 oC to 25 oC followed by thermal cycling between -40 to 125 oC. Results of the analysis show that the package warps with a magnitude of 93 µm at 25 oC after re-flow. In this process, the critical solder joint accumulated an inelastic strain of 0.856 percent. Faster temperature ramp rate at 370 oC/min (load case TR1) versus 33 oC/min (load case TC1) resulted in 12 percent lower inelastic strain after completing 3 temperature cycles. However, the inelastic strain magnitude is achieved in a much shorter time. The shear stressstrain hysteresis loops display the largest strain ranges compared to other stressstrain components. The calculated shear strain range is 0.8 percent with the corresponding stress range of 34.0 MPa.
format Article
author Tamin, M N
Liew, Y B
author_facet Tamin, M N
Liew, Y B
author_sort Tamin, M N
title Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
title_short Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
title_full Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
title_fullStr Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
title_full_unstemmed Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
title_sort numerical modeling of cyclic stress-strain behavior of sn-pb solder joint during thermal fatigue
publisher Universiti Kebangsaan Malaysia
publishDate 2005
url http://eprints.utm.my/id/eprint/470/1/cem05-039_MNTamin__Ed_3.pdf
http://eprints.utm.my/id/eprint/470/
_version_ 1643643109362368512
score 13.211869

Similar Items