Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in Pb-free solder interconnects
The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Perform...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/40122/ http://dx.doi.org/10.1109/IEMT.2012.6521786 |
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