Cover Image

Development of vapor pressure in FR4-copper composite material during solder reflow process

This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite materia...

Full description

Saved in:
Bibliographic Details
Main Authors: Kamsah, Nazri, Tamin, Mohd. Nasir, Mohamed Kamar, Haslinda, Lahuri, Hidayatunnur, Wagiman, Amir Nur Rashid
Format: Book Section
Published: American Institute of Physics 2012
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/35239/
http://dx.doi.org/10.1063/1.4704209
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utm.35239
record_format eprints
spelling my.utm.352392017-02-02T05:42:10Z http://eprints.utm.my/id/eprint/35239/ Development of vapor pressure in FR4-copper composite material during solder reflow process Kamsah, Nazri Tamin, Mohd. Nasir Mohamed Kamar, Haslinda Lahuri, Hidayatunnur Wagiman, Amir Nur Rashid TJ Mechanical engineering and machinery This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite material. FE simulation of transient moisture absorption was performed to predict the distribution of wetness fraction in the material after pre-conditioning at an 85°C/85%RH environment for 15 days. FE simulation of transient moisture desorption was carried out at the peak solder reflow temperature of 215°C to predict new distribution of wetness fraction in the material. The results of the moisture desorption analysis were used to compute the magnitude of vapor pressure in the material and its distribution at 215°C. It was found that the moisture in the material redistributes itself during solder reflow. The moisture concentration in the area close to the FR4-copper interface below the longer copper trace increases during the solder reflow. The magnitude of the vapor pressure in 70% of the FR4 and near the FR4-copper interface below the lower copper trace is closed to the saturation pressure of water vapor at 215°C. The distribution of the vapor pressure in the material is in similar fashion as the new distribution of wetness fraction after the moisture desorption analysis. American Institute of Physics 2012 Book Section PeerReviewed Kamsah, Nazri and Tamin, Mohd. Nasir and Mohamed Kamar, Haslinda and Lahuri, Hidayatunnur and Wagiman, Amir Nur Rashid (2012) Development of vapor pressure in FR4-copper composite material during solder reflow process. In: 4th International Meeting of Advances in Thermofluids, IMAT 2011. American Institute of Physics, Melville, New York, pp. 116-123. ISBN 978-073541032-9 http://dx.doi.org/10.1063/1.4704209 DOI:10.1063/1.4704209
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Kamsah, Nazri
Tamin, Mohd. Nasir
Mohamed Kamar, Haslinda
Lahuri, Hidayatunnur
Wagiman, Amir Nur Rashid
Development of vapor pressure in FR4-copper composite material during solder reflow process
description This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite material. FE simulation of transient moisture absorption was performed to predict the distribution of wetness fraction in the material after pre-conditioning at an 85°C/85%RH environment for 15 days. FE simulation of transient moisture desorption was carried out at the peak solder reflow temperature of 215°C to predict new distribution of wetness fraction in the material. The results of the moisture desorption analysis were used to compute the magnitude of vapor pressure in the material and its distribution at 215°C. It was found that the moisture in the material redistributes itself during solder reflow. The moisture concentration in the area close to the FR4-copper interface below the longer copper trace increases during the solder reflow. The magnitude of the vapor pressure in 70% of the FR4 and near the FR4-copper interface below the lower copper trace is closed to the saturation pressure of water vapor at 215°C. The distribution of the vapor pressure in the material is in similar fashion as the new distribution of wetness fraction after the moisture desorption analysis.
format Book Section
author Kamsah, Nazri
Tamin, Mohd. Nasir
Mohamed Kamar, Haslinda
Lahuri, Hidayatunnur
Wagiman, Amir Nur Rashid
author_facet Kamsah, Nazri
Tamin, Mohd. Nasir
Mohamed Kamar, Haslinda
Lahuri, Hidayatunnur
Wagiman, Amir Nur Rashid
author_sort Kamsah, Nazri
title Development of vapor pressure in FR4-copper composite material during solder reflow process
title_short Development of vapor pressure in FR4-copper composite material during solder reflow process
title_full Development of vapor pressure in FR4-copper composite material during solder reflow process
title_fullStr Development of vapor pressure in FR4-copper composite material during solder reflow process
title_full_unstemmed Development of vapor pressure in FR4-copper composite material during solder reflow process
title_sort development of vapor pressure in fr4-copper composite material during solder reflow process
publisher American Institute of Physics
publishDate 2012
url http://eprints.utm.my/id/eprint/35239/
http://dx.doi.org/10.1063/1.4704209
_version_ 1643649803765153792
score 13.211869

Similar Items