Optimization Of Solder Paste Printing Parameters Using Design Of Experiments (DOE)
The Solder Paste Printing Process Is An Important Process In The Assembly Of Surface Mount Technology (SMT) Devices Using The Reflow Soldering Technique. There Is A Wide Agreement In The Industry That The Paste Printing Process Accounts For The Majority Of Assembly Defects. Experience With This Proc...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UTM Press
2005
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/1719/1/JTDIS43A2.pdf http://eprints.utm.my/id/eprint/1719/ http://www.jurnalteknologi.utm.my/index.php/jurnalteknologi/article/view/754 |
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