Modeling of temperature variations in MOSFET mismatch for circuit simulations
Temperature effect is one of the critical factors in manufacturing variability which could affect the designed circuit. This paper presents a MOSFET mismatch model with the consideration of temperature variations using physical based SPICE model parameters. The model development includes the mismatc...
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Main Authors: | , , |
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Format: | Book Section |
Published: |
Institute of Electrical and Electronics Engineers
2009
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Subjects: | |
Online Access: | http://eprints.utm.my/id/eprint/12975/ http://dx.doi.org/10.1109/ASQED.2009.5206238 |
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