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Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction

Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizi...

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Main Authors: Mat, Mohamad Nur Hidayat, Radzie, Nabil Rusydan Nasa, Saidur, Rahman
Format: Article
Published: Springer Nature 2024
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/108961/
http://dx.doi.org/10.1007/s10973-024-13388-x
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spelling my.utm.1089612024-12-16T00:48:19Z http://eprints.utm.my/108961/ Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction Mat, Mohamad Nur Hidayat Radzie, Nabil Rusydan Nasa Saidur, Rahman TJ Mechanical engineering and machinery Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizing numerical simulations, we analyze nanofluid concentrations, flow dynamics, and performance evaluation criteria (PEC) using an Eulerian model to characterize the inhomogeneous flow properties. Concentrations ranging from 0.01 to 0.04 vol% are incrementally examined, with validation against experimental data to ensure accuracy. Key findings reveal that at a Reynolds number (Re) of 300, a 0.04 vol% nanofluid fraction yields a 20.1% reduction in thermal resistance compared to pure water. Moreover, at Re 1000, the heat transfer coefficient improves by 29.4% compared to the 0.04 vol% concentration. These results underscore the potential of MXene nanoflakes as adequate heat sink working fluids for electronics cooling. Applications of this research extend to various electronic devices and systems requiring efficient cooling mechanisms. By leveraging MXene nanofluids, manufacturers can enhance thermal management in microelectronic components, such as integrated circuits, LEDs, and power electronics. Additionally, this study’s insights can inform the design and optimization of cooling systems in high-performance computing, automotive electronics, and aerospace applications, where heat dissipation is critical for maintaining device reliability and performance. Springer Nature 2024 Article PeerReviewed Mat, Mohamad Nur Hidayat and Radzie, Nabil Rusydan Nasa and Saidur, Rahman (2024) Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction. Journal of Thermal Analysis and Calorimetry, 149 (17). pp. 9791-9803. ISSN 1388-6150 http://dx.doi.org/10.1007/s10973-024-13388-x DOI:10.1007/s10973-024-13388-x
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Mat, Mohamad Nur Hidayat
Radzie, Nabil Rusydan Nasa
Saidur, Rahman
Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
description Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizing numerical simulations, we analyze nanofluid concentrations, flow dynamics, and performance evaluation criteria (PEC) using an Eulerian model to characterize the inhomogeneous flow properties. Concentrations ranging from 0.01 to 0.04 vol% are incrementally examined, with validation against experimental data to ensure accuracy. Key findings reveal that at a Reynolds number (Re) of 300, a 0.04 vol% nanofluid fraction yields a 20.1% reduction in thermal resistance compared to pure water. Moreover, at Re 1000, the heat transfer coefficient improves by 29.4% compared to the 0.04 vol% concentration. These results underscore the potential of MXene nanoflakes as adequate heat sink working fluids for electronics cooling. Applications of this research extend to various electronic devices and systems requiring efficient cooling mechanisms. By leveraging MXene nanofluids, manufacturers can enhance thermal management in microelectronic components, such as integrated circuits, LEDs, and power electronics. Additionally, this study’s insights can inform the design and optimization of cooling systems in high-performance computing, automotive electronics, and aerospace applications, where heat dissipation is critical for maintaining device reliability and performance.
format Article
author Mat, Mohamad Nur Hidayat
Radzie, Nabil Rusydan Nasa
Saidur, Rahman
author_facet Mat, Mohamad Nur Hidayat
Radzie, Nabil Rusydan Nasa
Saidur, Rahman
author_sort Mat, Mohamad Nur Hidayat
title Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
title_short Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
title_full Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
title_fullStr Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
title_full_unstemmed Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
title_sort thermohydraulic performance of mxene-based nanofluid in a microchannel heat sink: effect of volume fraction
publisher Springer Nature
publishDate 2024
url http://eprints.utm.my/108961/
http://dx.doi.org/10.1007/s10973-024-13388-x
_version_ 1818834072160436224
score 13.223943

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