Thermohydraulic performance of MXene-based nanofluid in a microchannel heat sink: effect of volume fraction
Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizi...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Springer Nature
2024
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| Subjects: | |
| Online Access: | http://eprints.utm.my/108961/ http://dx.doi.org/10.1007/s10973-024-13388-x |
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| Summary: | Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizing numerical simulations, we analyze nanofluid concentrations, flow dynamics, and performance evaluation criteria (PEC) using an Eulerian model to characterize the inhomogeneous flow properties. Concentrations ranging from 0.01 to 0.04 vol% are incrementally examined, with validation against experimental data to ensure accuracy. Key findings reveal that at a Reynolds number (Re) of 300, a 0.04 vol% nanofluid fraction yields a 20.1% reduction in thermal resistance compared to pure water. Moreover, at Re 1000, the heat transfer coefficient improves by 29.4% compared to the 0.04 vol% concentration. These results underscore the potential of MXene nanoflakes as adequate heat sink working fluids for electronics cooling. Applications of this research extend to various electronic devices and systems requiring efficient cooling mechanisms. By leveraging MXene nanofluids, manufacturers can enhance thermal management in microelectronic components, such as integrated circuits, LEDs, and power electronics. Additionally, this study’s insights can inform the design and optimization of cooling systems in high-performance computing, automotive electronics, and aerospace applications, where heat dissipation is critical for maintaining device reliability and performance. |
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