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3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.

The continuous scaling of silicon technology has enabled many-core systems to become ubiquitous, offering enormous computational power for various applications spanning from high-performance computing to mobile devices. However, this advancement resulted in increased power density that exacerbated t...

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Main Authors:	Mohammed, Mohammed Sultan, Al-Dhamari, Ahlam, Hamdan, Mosab, Saad, Abdul-Malik H.Y., Abdul-Qawy, Antar S.H.
Format:	Article
Language:	English
Published:	Institute of Electrical and Electronics Engineers Inc. 2023
Subjects:	T58.6-58.62 Management information systems TK7885-7895 Computer engineer. Computer hardware
Online Access:	http://eprints.utm.my/104907/1/MohammedSultanMohammed2023_3DDNaPEDynamicNeighborAwarePerformanceEnhancement.pdf http://eprints.utm.my/104907/ http://dx.doi.org/10.1109/ACCESS.2023.3336280
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spelling	my.utm.1049072024-03-25T09:33:29Z http://eprints.utm.my/104907/ 3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems. Mohammed, Mohammed Sultan Al-Dhamari, Ahlam Hamdan, Mosab Saad, Abdul-Malik H.Y. Abdul-Qawy, Antar S.H. T58.6-58.62 Management information systems TK7885-7895 Computer engineer. Computer hardware The continuous scaling of silicon technology has enabled many-core systems to become ubiquitous, offering enormous computational power for various applications spanning from high-performance computing to mobile devices. However, this advancement resulted in increased power density that exacerbated the thermal challenges of dark silicon, where certain cores are turned off or become dark due to thermal constraints. While various methods have been put forward to enhance the performance of thermally constrained 2D many-core systems, 3D designs introduce more serious thermal issues due to heightened power density and challenges with heat dissipation in vertically stacked configurations. This paper introduces a dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems (3D-DNaPE). 3D-DNaPE is a technique that improves the performance of a thermally constrained 3D many-core system where only a limited number of cores can be activated. Initially, it uses the proposed neighbor-aware pattern (NaP) algorithm to select the coldest core among the four adjacent dark cores suitable for task migration. Subsequently, it uses the proposed 3D dynamic thermal management (3D-DTM) algorithm to optimize system performance by considering the core and memory bank temperatures. A static non-uniform cache access (S-NUCA) configuration mitigates cache misses resulting from task migration. Comprehensive evaluations indicate that 3D-DNaPE performs better than its contemporaries, showing improvements reaching up to 43% in execution time, a 34% decrease in performance slowdown, and an up to 51% enhancement in energy efficiency. This research not only underscores the challenges faced by 3D many-core systems but also provides a robust solution with promising implications for future 3D many-core designs. Institute of Electrical and Electronics Engineers Inc. 2023-11-23 Article PeerReviewed application/pdf en http://eprints.utm.my/104907/1/MohammedSultanMohammed2023_3DDNaPEDynamicNeighborAwarePerformanceEnhancement.pdf Mohammed, Mohammed Sultan and Al-Dhamari, Ahlam and Hamdan, Mosab and Saad, Abdul-Malik H.Y. and Abdul-Qawy, Antar S.H. (2023) 3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems. IEEE Access, 11 . pp. 131964-131978. ISSN 2169-3536 http://dx.doi.org/10.1109/ACCESS.2023.3336280 DOI: 10.1109/ACCESS.2023.3336280
institution	Universiti Teknologi Malaysia
building	UTM Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Teknologi Malaysia
content_source	UTM Institutional Repository
url_provider	http://eprints.utm.my/
language	English
topic	T58.6-58.62 Management information systems TK7885-7895 Computer engineer. Computer hardware
spellingShingle	T58.6-58.62 Management information systems TK7885-7895 Computer engineer. Computer hardware Mohammed, Mohammed Sultan Al-Dhamari, Ahlam Hamdan, Mosab Saad, Abdul-Malik H.Y. Abdul-Qawy, Antar S.H. 3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
description	The continuous scaling of silicon technology has enabled many-core systems to become ubiquitous, offering enormous computational power for various applications spanning from high-performance computing to mobile devices. However, this advancement resulted in increased power density that exacerbated the thermal challenges of dark silicon, where certain cores are turned off or become dark due to thermal constraints. While various methods have been put forward to enhance the performance of thermally constrained 2D many-core systems, 3D designs introduce more serious thermal issues due to heightened power density and challenges with heat dissipation in vertically stacked configurations. This paper introduces a dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems (3D-DNaPE). 3D-DNaPE is a technique that improves the performance of a thermally constrained 3D many-core system where only a limited number of cores can be activated. Initially, it uses the proposed neighbor-aware pattern (NaP) algorithm to select the coldest core among the four adjacent dark cores suitable for task migration. Subsequently, it uses the proposed 3D dynamic thermal management (3D-DTM) algorithm to optimize system performance by considering the core and memory bank temperatures. A static non-uniform cache access (S-NUCA) configuration mitigates cache misses resulting from task migration. Comprehensive evaluations indicate that 3D-DNaPE performs better than its contemporaries, showing improvements reaching up to 43% in execution time, a 34% decrease in performance slowdown, and an up to 51% enhancement in energy efficiency. This research not only underscores the challenges faced by 3D many-core systems but also provides a robust solution with promising implications for future 3D many-core designs.
format	Article
author	Mohammed, Mohammed Sultan Al-Dhamari, Ahlam Hamdan, Mosab Saad, Abdul-Malik H.Y. Abdul-Qawy, Antar S.H.
author_facet	Mohammed, Mohammed Sultan Al-Dhamari, Ahlam Hamdan, Mosab Saad, Abdul-Malik H.Y. Abdul-Qawy, Antar S.H.
author_sort	Mohammed, Mohammed Sultan
title	3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
title_short	3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
title_full	3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
title_fullStr	3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
title_full_unstemmed	3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
title_sort	3d-dnape: dynamic neighbor-aware performance enhancement for thermally constrained 3d many-core systems.
publisher	Institute of Electrical and Electronics Engineers Inc.
publishDate	2023
url	http://eprints.utm.my/104907/1/MohammedSultanMohammed2023_3DDNaPEDynamicNeighborAwarePerformanceEnhancement.pdf http://eprints.utm.my/104907/ http://dx.doi.org/10.1109/ACCESS.2023.3336280
_version_	1794545946358448128
score	13.211869

3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.

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