3D-DNaPE: dynamic neighbor-aware performance enhancement for thermally constrained 3D many-core systems.
The continuous scaling of silicon technology has enabled many-core systems to become ubiquitous, offering enormous computational power for various applications spanning from high-performance computing to mobile devices. However, this advancement resulted in increased power density that exacerbated t...
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Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
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Subjects: | |
Online Access: | http://eprints.utm.my/104907/1/MohammedSultanMohammed2023_3DDNaPEDynamicNeighborAwarePerformanceEnhancement.pdf http://eprints.utm.my/104907/ http://dx.doi.org/10.1109/ACCESS.2023.3336280 |
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