Cover Image

Variability reduction in stencil printing of solder paste for surface mount technology

Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . Howeve...

Full description

Saved in:
Bibliographic Details
Main Author: Ibrahim, Mustaffa
Format: Thesis
Language:English
Published: 1998
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
TK7800-8360 Electronics
Online Access:http://eprints.uthm.edu.my/7697/1/24p%20MUSTAFFA%20IBRAHIM.pdf
http://eprints.uthm.edu.my/7697/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.uthm.eprints.7697
record_format eprints
spelling my.uthm.eprints.76972022-09-19T02:03:35Z http://eprints.uthm.edu.my/7697/ Variability reduction in stencil printing of solder paste for surface mount technology Ibrahim, Mustaffa TK Electrical engineering. Electronics Nuclear engineering TK7800-8360 Electronics Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . However. understanding these failures are a challenging problem as the printing process has a large number of non linearly dependent variables such as factors relating to paste (formulation. viscosity), the environment (temperature, humidity) and machine parameter (alignment, pressure and speed of squeegee, blade hardness etc). The process engineer is challenged to widen the process window so that future modifications to the process, such as the addition of a new component, can be achieved with little. if any, change in materials or process parameters. This thesis reports the effect of temperature and humidity variation from the manufacturing environment on the solder paste consistency and optimization of the essential parameters of squeegee pressure, squeegee speed. separation speed and print gap. The outcome of variation in temperature and humidity to the solder paste viscosity were analyzed and tests were done to determine the characteristic of the solder paste. The tests results indicate that the temperature and humidity has an impact on the solder paste printability. thus some attempts must be taken to control these variables. For parameter optimization. the analysis was carried out using statistical optimization. The main aim was to combine these parameters with three main pitch categories to produce the acceptable print formation. The results showed that. the ideal print result requires optimum statistical combinations of four parameters essentially related to a particular pitch. It is also shown that there is a diversity and contrasts of the combination of the parameters for each category of pitch. Detailed explanations as to the phenomenon are outlined in the thesis. 1998-11 Thesis NonPeerReviewed text en http://eprints.uthm.edu.my/7697/1/24p%20MUSTAFFA%20IBRAHIM.pdf Ibrahim, Mustaffa (1998) Variability reduction in stencil printing of solder paste for surface mount technology. Masters thesis, Universiti Teknologi Malaysia, Institut Teknologi Tun Hussein Onn.
institution Universiti Tun Hussein Onn Malaysia
building UTHM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
url_provider http://eprints.uthm.edu.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
TK7800-8360 Electronics
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
TK7800-8360 Electronics
Ibrahim, Mustaffa
Variability reduction in stencil printing of solder paste for surface mount technology
description Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . However. understanding these failures are a challenging problem as the printing process has a large number of non linearly dependent variables such as factors relating to paste (formulation. viscosity), the environment (temperature, humidity) and machine parameter (alignment, pressure and speed of squeegee, blade hardness etc). The process engineer is challenged to widen the process window so that future modifications to the process, such as the addition of a new component, can be achieved with little. if any, change in materials or process parameters. This thesis reports the effect of temperature and humidity variation from the manufacturing environment on the solder paste consistency and optimization of the essential parameters of squeegee pressure, squeegee speed. separation speed and print gap. The outcome of variation in temperature and humidity to the solder paste viscosity were analyzed and tests were done to determine the characteristic of the solder paste. The tests results indicate that the temperature and humidity has an impact on the solder paste printability. thus some attempts must be taken to control these variables. For parameter optimization. the analysis was carried out using statistical optimization. The main aim was to combine these parameters with three main pitch categories to produce the acceptable print formation. The results showed that. the ideal print result requires optimum statistical combinations of four parameters essentially related to a particular pitch. It is also shown that there is a diversity and contrasts of the combination of the parameters for each category of pitch. Detailed explanations as to the phenomenon are outlined in the thesis.
format Thesis
author Ibrahim, Mustaffa
author_facet Ibrahim, Mustaffa
author_sort Ibrahim, Mustaffa
title Variability reduction in stencil printing of solder paste for surface mount technology
title_short Variability reduction in stencil printing of solder paste for surface mount technology
title_full Variability reduction in stencil printing of solder paste for surface mount technology
title_fullStr Variability reduction in stencil printing of solder paste for surface mount technology
title_full_unstemmed Variability reduction in stencil printing of solder paste for surface mount technology
title_sort variability reduction in stencil printing of solder paste for surface mount technology
publishDate 1998
url http://eprints.uthm.edu.my/7697/1/24p%20MUSTAFFA%20IBRAHIM.pdf
http://eprints.uthm.edu.my/7697/
_version_ 1744650654841831424
score 13.211869

Similar Items