Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
The growth of an intermetallic compound (IMC) can influence the behavior of solder joints. In this study, the different percentages of Ag in Sn-xAg (value x = 2.5 and 3.5 wt.%) solder alloy were involved along with ENImAg surface finish to reveal the solder joints reliability in term of IMC thicknes...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
WARSE
2020
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/6341/1/AJ%202020%20%28818%29.pdf http://eprints.uthm.edu.my/6341/ https://doi.org/10.30534/ijeter/2020/0881.22020 |
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