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Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish

The growth of an intermetallic compound (IMC) can influence the behavior of solder joints. In this study, the different percentages of Ag in Sn-xAg (value x = 2.5 and 3.5 wt.%) solder alloy were involved along with ENImAg surface finish to reveal the solder joints reliability in term of IMC thicknes...

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Main Authors: Mohamed Anuar, Rabiatul Adawiyah, Hamidin, Mohamad Shahrom, Osman, Saliza Azlina, Othman, Mohamad Hilmi
Format: Article
Language:English
Published: WARSE 2020
Subjects:
TP155-156 Chemical engineering
Online Access:http://eprints.uthm.edu.my/6341/1/AJ%202020%20%28818%29.pdf
http://eprints.uthm.edu.my/6341/
https://doi.org/10.30534/ijeter/2020/0881.22020
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spelling my.uthm.eprints.63412022-01-30T03:49:23Z http://eprints.uthm.edu.my/6341/ Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish Mohamed Anuar, Rabiatul Adawiyah Hamidin, Mohamad Shahrom Osman, Saliza Azlina Othman, Mohamad Hilmi TP155-156 Chemical engineering The growth of an intermetallic compound (IMC) can influence the behavior of solder joints. In this study, the different percentages of Ag in Sn-xAg (value x = 2.5 and 3.5 wt.%) solder alloy were involved along with ENImAg surface finish to reveal the solder joints reliability in term of IMC thickness, morphology and strength of solder joint under reflow and multiple reflows. The characterization and samples analysis were examined by OM and SEM/EDX. The observation revealed that the IMC of Sn-xAg/ENImAg which were formed on the interface were Ni3Sn4 and NiSn-P layer after multiple reflows soldering. The kinetic growth of each IMC was observed. It revealed that the layer of IMC was thicker as the reflow increased and became thinner with higher mass percentages of Ag. For solder joint strength, the fracture surface with ductile characteristics at the Sn-Ag/ENImAg interface, which indicated that an increase of Ag wt.% in the solder, increases the strength of the solder joint. Upon the revelation of these observations, the reliability of the solder joint is related to the reflow condition and mass percentages of the element in the solder alloy. WARSE 2020 Article PeerReviewed text en http://eprints.uthm.edu.my/6341/1/AJ%202020%20%28818%29.pdf Mohamed Anuar, Rabiatul Adawiyah and Hamidin, Mohamad Shahrom and Osman, Saliza Azlina and Othman, Mohamad Hilmi (2020) Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish. International Journal of Emerging Trends in Engineering Research, 8 (1). pp. 52-59. ISSN 2347-3983 https://doi.org/10.30534/ijeter/2020/0881.22020
institution Universiti Tun Hussein Onn Malaysia
building UTHM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tun Hussein Onn Malaysia
content_source UTHM Institutional Repository
url_provider http://eprints.uthm.edu.my/
language English
topic TP155-156 Chemical engineering
spellingShingle TP155-156 Chemical engineering
Mohamed Anuar, Rabiatul Adawiyah
Hamidin, Mohamad Shahrom
Osman, Saliza Azlina
Othman, Mohamad Hilmi
Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
description The growth of an intermetallic compound (IMC) can influence the behavior of solder joints. In this study, the different percentages of Ag in Sn-xAg (value x = 2.5 and 3.5 wt.%) solder alloy were involved along with ENImAg surface finish to reveal the solder joints reliability in term of IMC thickness, morphology and strength of solder joint under reflow and multiple reflows. The characterization and samples analysis were examined by OM and SEM/EDX. The observation revealed that the IMC of Sn-xAg/ENImAg which were formed on the interface were Ni3Sn4 and NiSn-P layer after multiple reflows soldering. The kinetic growth of each IMC was observed. It revealed that the layer of IMC was thicker as the reflow increased and became thinner with higher mass percentages of Ag. For solder joint strength, the fracture surface with ductile characteristics at the Sn-Ag/ENImAg interface, which indicated that an increase of Ag wt.% in the solder, increases the strength of the solder joint. Upon the revelation of these observations, the reliability of the solder joint is related to the reflow condition and mass percentages of the element in the solder alloy.
format Article
author Mohamed Anuar, Rabiatul Adawiyah
Hamidin, Mohamad Shahrom
Osman, Saliza Azlina
Othman, Mohamad Hilmi
author_facet Mohamed Anuar, Rabiatul Adawiyah
Hamidin, Mohamad Shahrom
Osman, Saliza Azlina
Othman, Mohamad Hilmi
author_sort Mohamed Anuar, Rabiatul Adawiyah
title Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
title_short Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
title_full Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
title_fullStr Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
title_full_unstemmed Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
title_sort intermetallic compound layer growth at the interface between sn-ag and enimag surface finish
publisher WARSE
publishDate 2020
url http://eprints.uthm.edu.my/6341/1/AJ%202020%20%28818%29.pdf
http://eprints.uthm.edu.my/6341/
https://doi.org/10.30534/ijeter/2020/0881.22020
_version_ 1738581480226947072
score 13.211869

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