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A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing

Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconduct...

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Main Authors: Ong, K.Y., SAID, MD RADZAI
Format: Article
Language:English
Published: Penerbit UTeM 2011
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf
http://eprints.utem.edu.my/id/eprint/9193/
http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40
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spelling my.utem.eprints.91932015-05-28T04:02:13Z http://eprints.utem.edu.my/id/eprint/9193/ A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing Ong, K.Y. SAID, MD RADZAI TJ Mechanical engineering and machinery Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconductor device testing. As a result, significant drop of contact performance has been observed. This study intends to find out a theoretical explanation to the problem of tin deposition. As soon as the root cause is identified, studies go into the details of how to solve this problem. One of the economical suggestions is to apply lubricants on the contact. A theoretical calculation is derived to verify if the lubricant would significantly altered the overall resistance. Penerbit UTeM 2011-01 Article PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf Ong, K.Y. and SAID, MD RADZAI (2011) A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing. Journal of Mechanical Engineering and Technology, 3 (1). pp. 1-9. ISSN 2180-1053 http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Ong, K.Y.
SAID, MD RADZAI
A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
description Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconductor device testing. As a result, significant drop of contact performance has been observed. This study intends to find out a theoretical explanation to the problem of tin deposition. As soon as the root cause is identified, studies go into the details of how to solve this problem. One of the economical suggestions is to apply lubricants on the contact. A theoretical calculation is derived to verify if the lubricant would significantly altered the overall resistance.
format Article
author Ong, K.Y.
SAID, MD RADZAI
author_facet Ong, K.Y.
SAID, MD RADZAI
author_sort Ong, K.Y.
title A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
title_short A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
title_full A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
title_fullStr A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
title_full_unstemmed A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
title_sort study on the deposition of tin on the contac ts subjected to high frequency impac t loading in semiconductor device testing
publisher Penerbit UTeM
publishDate 2011
url http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf
http://eprints.utem.edu.my/id/eprint/9193/
http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40
_version_ 1665905390487863296
score 13.223943

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