A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconduct...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UTeM
2011
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf http://eprints.utem.edu.my/id/eprint/9193/ http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40 |
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| Summary: | Semiconductor device leads were previously plated with Lead (Pb). Due to
environmental concern, the plating material has been switched to Tin (Sn).
However, due to the softness of Tin element plating, it often wears off and
its residues deposited to the surface of the contacts used in semiconductor
device testing. As a result, significant drop of contact performance has been
observed. This study intends to find out a theoretical explanation to the
problem of tin deposition. As soon as the root cause is identified, studies
go into the details of how to solve this problem. One of the economical
suggestions is to apply lubricants on the contact. A theoretical calculation
is derived to verify if the lubricant would significantly altered the overall
resistance. |
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