Cover Image

The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness

Surface morphology modification during in situ cleaning of physical vapor deposition (PVD) process is essential to strengthen and prevent unexpected adhesion failure during machining. Applying pulse direct current (PDC) on substrate bias is still uncommon compared to a conventional direct current (D...

Full description

Saved in:
Bibliographic Details
Main Authors: Hashim, Hanizam, Md Nizam, Abd Rahman, Noraiham, Mohamad, Khairul Anuar, Abd Rahman
Format: Article
Language:English
Published: Elsevier Ltd 2013
Subjects:
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/7078/1/Hanizam-mucet2012.pdf
http://eprints.utem.edu.my/id/eprint/7078/
http://authors.elsevier.com/sd/article/S1877705813001914
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utem.eprints.7078
record_format eprints
spelling my.utem.eprints.70782022-02-14T14:26:14Z http://eprints.utem.edu.my/id/eprint/7078/ The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness Hashim, Hanizam Md Nizam, Abd Rahman Noraiham, Mohamad Khairul Anuar, Abd Rahman TS Manufactures Surface morphology modification during in situ cleaning of physical vapor deposition (PVD) process is essential to strengthen and prevent unexpected adhesion failure during machining. Applying pulse direct current (PDC) on substrate bias is still uncommon compared to a conventional direct current (DC). This paper is to compare the effects of DC and PDC applied at substrate bias, to the surface roughness and homogeneity. Tungsten carbide (WC) cutting tool insert and argon were used as substrate and inert gas, respectively. The runs were conducted to compare the bias at DC (-500V) and PDC (-200V, -500V, -800V). The surface roughness and homogeneity were inspected using atomic forced microscopy (AFM) and Minitab version 16 exploited to analyze the data. The wettability based on water drop static contact angle on the substrate surface was measured by a digital 800k USB 2.0 CCD DCAM and VIS ver7 (Professional Edition) software. PDC on the substrate bias produced finer grain structures compared to DC. Further increase in PDC voltage resulted in homogenous surface with finer and more globular microstructure with higher surface energy. Hence PDC at optimum level provides better surface readiness prior to coating compared to DC and proven to be a critical factor for further enhancement of coating adhesion. Elsevier Ltd 2013-03-30 Article NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/7078/1/Hanizam-mucet2012.pdf Hashim, Hanizam and Md Nizam, Abd Rahman and Noraiham, Mohamad and Khairul Anuar, Abd Rahman (2013) The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness. The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness, 53 (20 (10.101). pp. 562-568. ISSN 1877-7058 http://authors.elsevier.com/sd/article/S1877705813001914 PROENG11464
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic TS Manufactures
spellingShingle TS Manufactures
Hashim, Hanizam
Md Nizam, Abd Rahman
Noraiham, Mohamad
Khairul Anuar, Abd Rahman
The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
description Surface morphology modification during in situ cleaning of physical vapor deposition (PVD) process is essential to strengthen and prevent unexpected adhesion failure during machining. Applying pulse direct current (PDC) on substrate bias is still uncommon compared to a conventional direct current (DC). This paper is to compare the effects of DC and PDC applied at substrate bias, to the surface roughness and homogeneity. Tungsten carbide (WC) cutting tool insert and argon were used as substrate and inert gas, respectively. The runs were conducted to compare the bias at DC (-500V) and PDC (-200V, -500V, -800V). The surface roughness and homogeneity were inspected using atomic forced microscopy (AFM) and Minitab version 16 exploited to analyze the data. The wettability based on water drop static contact angle on the substrate surface was measured by a digital 800k USB 2.0 CCD DCAM and VIS ver7 (Professional Edition) software. PDC on the substrate bias produced finer grain structures compared to DC. Further increase in PDC voltage resulted in homogenous surface with finer and more globular microstructure with higher surface energy. Hence PDC at optimum level provides better surface readiness prior to coating compared to DC and proven to be a critical factor for further enhancement of coating adhesion.
format Article
author Hashim, Hanizam
Md Nizam, Abd Rahman
Noraiham, Mohamad
Khairul Anuar, Abd Rahman
author_facet Hashim, Hanizam
Md Nizam, Abd Rahman
Noraiham, Mohamad
Khairul Anuar, Abd Rahman
author_sort Hashim, Hanizam
title The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
title_short The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
title_full The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
title_fullStr The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
title_full_unstemmed The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
title_sort effect of pulse dc and dc substrate bias during in situ cleaning pvd process on surface roughness
publisher Elsevier Ltd
publishDate 2013
url http://eprints.utem.edu.my/id/eprint/7078/1/Hanizam-mucet2012.pdf
http://eprints.utem.edu.my/id/eprint/7078/
http://authors.elsevier.com/sd/article/S1877705813001914
_version_ 1725976109249462272
score 13.211869

Similar Items