The Effect of Pulse DC and DC Substrate Bias during In Situ Cleaning PVD Process on Surface Roughness
Surface morphology modification during in situ cleaning of physical vapor deposition (PVD) process is essential to strengthen and prevent unexpected adhesion failure during machining. Applying pulse direct current (PDC) on substrate bias is still uncommon compared to a conventional direct current (D...
Saved in:
Main Authors: | , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier Ltd
2013
|
Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/7078/1/Hanizam-mucet2012.pdf http://eprints.utem.edu.my/id/eprint/7078/ http://authors.elsevier.com/sd/article/S1877705813001914 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|