Integrated feed forward system for chemical mechanical polishing oxide removal process automation to improve productivity
Chemical Mechanical Planarization (CMP) is one of the main processes in semiconductor wafer fabrication. It is the only process that has contact physically with the wafer, where a pad is placed directly onto the wafer and polished in a circular motion at a particular speed to planarize the wafer sur...
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | English English |
| منشور في: |
2022
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/26945/1/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf http://eprints.utem.edu.my/id/eprint/26945/2/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf http://eprints.utem.edu.my/id/eprint/26945/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122157 |
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الانترنت
http://eprints.utem.edu.my/id/eprint/26945/1/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdfhttp://eprints.utem.edu.my/id/eprint/26945/2/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf
http://eprints.utem.edu.my/id/eprint/26945/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122157