Integrated feed forward system for chemical mechanical polishing oxide removal process automation to improve productivity
Chemical Mechanical Planarization (CMP) is one of the main processes in semiconductor wafer fabrication. It is the only process that has contact physically with the wafer, where a pad is placed directly onto the wafer and polished in a circular motion at a particular speed to planarize the wafer sur...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2022
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| Online Access: | http://eprints.utem.edu.my/id/eprint/26945/1/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf http://eprints.utem.edu.my/id/eprint/26945/2/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf http://eprints.utem.edu.my/id/eprint/26945/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122157 |
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http://eprints.utem.edu.my/id/eprint/26945/1/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdfhttp://eprints.utem.edu.my/id/eprint/26945/2/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf
http://eprints.utem.edu.my/id/eprint/26945/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122157