The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging
Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2022
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| Online Access: | http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf http://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf http://eprints.utem.edu.my/id/eprint/26873/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122194 |
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http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdfhttp://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf
http://eprints.utem.edu.my/id/eprint/26873/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122194