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Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...

詳細記述

保存先:
書誌詳細
第一著者: Jamaluddin, Nurezzaty
フォーマット: 学位論文
言語:English
English
出版事項: 2020
主題:
T Technology (General)
TJ Mechanical engineering and machinery
オンライン･アクセス:http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
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インターネット

http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199

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