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Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...

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Bibliographic Details
Main Author: Jamaluddin, Nurezzaty
Format: Thesis
Language:English
English
Published: 2020
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
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spelling my.utem.eprints.255722022-01-06T14:05:27Z http://eprints.utem.edu.my/id/eprint/25572/ Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application Jamaluddin, Nurezzaty T Technology (General) TJ Mechanical engineering and machinery This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if backside chipping increases, sidewall chipping will increases as well. In order to reduce backside chipping, investigation had found three potential area that may improve backside and sidewall chipping with parameter optimization. Two main element was identified on this problem which are material and machine. Z2 blade type is identify as one of contribution of this issue and machine parameter for chuck table feedspeed and cutting ratio are the other variance that causing higher backside chipping. By using six sigma tools (DMAIC) this project resulted improve yield performance with new type ofZ2 blade with optimize parameter of table feedspeed and cutting depth ratio. 2020 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf text en http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf Jamaluddin, Nurezzaty (2020) Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TJ Mechanical engineering and machinery
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
Jamaluddin, Nurezzaty
Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
description This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if backside chipping increases, sidewall chipping will increases as well. In order to reduce backside chipping, investigation had found three potential area that may improve backside and sidewall chipping with parameter optimization. Two main element was identified on this problem which are material and machine. Z2 blade type is identify as one of contribution of this issue and machine parameter for chuck table feedspeed and cutting ratio are the other variance that causing higher backside chipping. By using six sigma tools (DMAIC) this project resulted improve yield performance with new type ofZ2 blade with optimize parameter of table feedspeed and cutting depth ratio.
format Thesis
author Jamaluddin, Nurezzaty
author_facet Jamaluddin, Nurezzaty
author_sort Jamaluddin, Nurezzaty
title Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_short Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_full Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_fullStr Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_full_unstemmed Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_sort backside chipping improvement of non-backcoated bare die device for mobile application
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
_version_ 1724077902852521984
score 13.211869

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