Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English English |
| Published: |
2020
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf http://eprints.utem.edu.my/id/eprint/25572/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199 |
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http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdfhttp://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199