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Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...

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书目详细资料
主要作者: Jamaluddin, Nurezzaty
格式: Thesis
语言:English
English
出版: 2020
主题:
T Technology (General)
TJ Mechanical engineering and machinery
在线阅读:http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
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因特网

http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199

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