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Mode stresses for a thermally insulated curve crack in bonded two half planes

Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement,...

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書誌詳細
主要な著者:	Hamzah, Khairum, Nik Long, Nik Mohd Asri, Senu, Norazak, Eshkuvatov, Zainiddin K.
フォーマット:	論文
言語:	English
出版事項:	Malaysian Journal Management System 2020
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/25295/2/MODE%20STRESSES%20FOR%20A%20THERMALLY%20INSULATED%20CURVE%20CRACK%20IN%20BONDED%20TWO%20HALF%20PLANES.PDF http://eprints.utem.edu.my/id/eprint/25295/ http://myjms.mohe.gov.my/index.php/dismath/article/view/13085/6758
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