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Mode stresses for a thermally insulated curve crack in bonded two half planes

Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement,...

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التفاصيل البيبلوغرافية
المؤلفون الرئيسيون: Hamzah, Khairum, Nik Long, Nik Mohd Asri, Senu, Norazak, Eshkuvatov, Zainiddin K.
التنسيق: مقال
اللغة:English
منشور في: Malaysian Journal Management System 2020
الوصول للمادة أونلاين:http://eprints.utem.edu.my/id/eprint/25295/2/MODE%20STRESSES%20FOR%20A%20THERMALLY%20INSULATED%20CURVE%20CRACK%20IN%20BONDED%20TWO%20HALF%20PLANES.PDF
http://eprints.utem.edu.my/id/eprint/25295/
http://myjms.mohe.gov.my/index.php/dismath/article/view/13085/6758
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spelling my.utem.eprints.252952023-07-20T16:01:51Z http://eprints.utem.edu.my/id/eprint/25295/ Mode stresses for a thermally insulated curve crack in bonded two half planes Hamzah, Khairum Nik Long, Nik Mohd Asri Senu, Norazak Eshkuvatov, Zainiddin K. Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement, resultant force and heat conduction functions. This new HSIEs is solve numerically by using curve length coordinate function and quadrature formulas for the unknown crack opening displacement (COD) function and the right hand side is the traction along the crack. The obtained COD function is then used to compute the stress intensity factors (SIF) in order to analyze the stability behavior of the materials containing cracks or flaws. Numerical results presented the behavior of nondimensional SIF at tips subjected to four mode stresses such as Mode I (Normal), Mode II (Shear), Mode III (Tearing) and Mix Mode stresses. Malaysian Journal Management System 2020-07 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/25295/2/MODE%20STRESSES%20FOR%20A%20THERMALLY%20INSULATED%20CURVE%20CRACK%20IN%20BONDED%20TWO%20HALF%20PLANES.PDF Hamzah, Khairum and Nik Long, Nik Mohd Asri and Senu, Norazak and Eshkuvatov, Zainiddin K. (2020) Mode stresses for a thermally insulated curve crack in bonded two half planes. Menemui Matematik (Discovering Mathematics), 42 (1). pp. 34-44. ISSN 2231-7023 http://myjms.mohe.gov.my/index.php/dismath/article/view/13085/6758
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement, resultant force and heat conduction functions. This new HSIEs is solve numerically by using curve length coordinate function and quadrature formulas for the unknown crack opening displacement (COD) function and the right hand side is the traction along the crack. The obtained COD function is then used to compute the stress intensity factors (SIF) in order to analyze the stability behavior of the materials containing cracks or flaws. Numerical results presented the behavior of nondimensional SIF at tips subjected to four mode stresses such as Mode I (Normal), Mode II (Shear), Mode III (Tearing) and Mix Mode stresses.
format Article
author Hamzah, Khairum
Nik Long, Nik Mohd Asri
Senu, Norazak
Eshkuvatov, Zainiddin K.
spellingShingle Hamzah, Khairum
Nik Long, Nik Mohd Asri
Senu, Norazak
Eshkuvatov, Zainiddin K.
Mode stresses for a thermally insulated curve crack in bonded two half planes
author_facet Hamzah, Khairum
Nik Long, Nik Mohd Asri
Senu, Norazak
Eshkuvatov, Zainiddin K.
author_sort Hamzah, Khairum
title Mode stresses for a thermally insulated curve crack in bonded two half planes
title_short Mode stresses for a thermally insulated curve crack in bonded two half planes
title_full Mode stresses for a thermally insulated curve crack in bonded two half planes
title_fullStr Mode stresses for a thermally insulated curve crack in bonded two half planes
title_full_unstemmed Mode stresses for a thermally insulated curve crack in bonded two half planes
title_sort mode stresses for a thermally insulated curve crack in bonded two half planes
publisher Malaysian Journal Management System
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25295/2/MODE%20STRESSES%20FOR%20A%20THERMALLY%20INSULATED%20CURVE%20CRACK%20IN%20BONDED%20TWO%20HALF%20PLANES.PDF
http://eprints.utem.edu.my/id/eprint/25295/
http://myjms.mohe.gov.my/index.php/dismath/article/view/13085/6758
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score 13.251813

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