Stress intensity factor for a thermally insulated crack in bonded dissimilar materials
The modified complex variable function method with the continuity conditions of the resultant force, displacement and heat conduction functions are used to formulate the Hypersingular Integral Equation (HSIE) for a thermally insulated circular arc crack or a thermally insulated inclined crack in the...
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Akademi Sains Malaysia
2019
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my.utem.eprints.243682023-07-20T16:08:23Z http://eprints.utem.edu.my/id/eprint/24368/ Stress intensity factor for a thermally insulated crack in bonded dissimilar materials Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. The modified complex variable function method with the continuity conditions of the resultant force, displacement and heat conduction functions are used to formulate the Hypersingular Integral Equation (HSIE) for a thermally insulated circular arc crack or a thermally insulated inclined crack in the upper part of bonded dissimilar materials subjected to remote stress. The HSIE is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right hand term using the appropriate quadrature formulas. Numerical results showed the behavior of the nondimensional Stress Intensity Factor (SIF) at all crack tips. The nondimensional SIF depends on the crack geometries, the distance between crack and the boundary, the elastic constants ratio, the heat conductivity ratio and the thermal expansion coefficients ratio Akademi Sains Malaysia 2019-12 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/24368/2/3_PUBLISHED%20VERSION_ICOAIMS%202019.PDF Nik Long, Nik Mohd Asri and Hamzah, Khairum and Senu, Norazak and Eshkuvatov, Zainiddin K. (2019) Stress intensity factor for a thermally insulated crack in bonded dissimilar materials. ASM Science Journal, 12 (5). pp. 98-106. ISSN 1823-6782 https://www.akademisains.gov.my/asmsj/article/stress-intensity-factor-for-a-thermally-insulated-crack-in-bonded-dissimilar-materials/ |
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The modified complex variable function method with the continuity conditions of the resultant force, displacement and heat conduction functions are used to formulate the Hypersingular Integral Equation (HSIE) for a thermally insulated circular arc crack or a thermally insulated inclined crack in the upper part of bonded dissimilar materials subjected to remote stress. The HSIE is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right hand term using the appropriate quadrature formulas. Numerical results showed the behavior of the nondimensional Stress Intensity Factor (SIF) at all crack tips. The nondimensional SIF depends on the crack geometries, the distance between crack and the boundary, the elastic constants ratio, the heat conductivity ratio and the thermal expansion coefficients ratio |
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Article |
author |
Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. |
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Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. Stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
author_facet |
Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. |
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Nik Long, Nik Mohd Asri |
title |
Stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
title_short |
Stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
title_full |
Stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
title_fullStr |
Stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
title_full_unstemmed |
Stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
title_sort |
stress intensity factor for a thermally insulated crack in bonded dissimilar materials |
publisher |
Akademi Sains Malaysia |
publishDate |
2019 |
url |
http://eprints.utem.edu.my/id/eprint/24368/2/3_PUBLISHED%20VERSION_ICOAIMS%202019.PDF http://eprints.utem.edu.my/id/eprint/24368/ https://www.akademisains.gov.my/asmsj/article/stress-intensity-factor-for-a-thermally-insulated-crack-in-bonded-dissimilar-materials/ |
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