Optimization of secondary bonding in layup process based on six sigma method

Composite manufacturing company is a company that produces parts for aeroplane which is made up of composite. Composite is the combination of more than one material to produce a strong part. One of the main problem of this part producing in the composite manufacturing company is recovering the panel...

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Main Author: Badaruddin, Nur Izayu
Format: Thesis
Language:English
English
Published: 2018
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/23992/1/Optimization%20of%20Secondary%20Bonding%20in%20Layup%20Process%20Based%20on%20Six%20Sigma%20Method.pdf
http://eprints.utem.edu.my/id/eprint/23992/2/Optimization%20of%20secondary%20bonding%20in%20layup%20process%20based%20on%20six%20sigma%20method.pdf
http://eprints.utem.edu.my/id/eprint/23992/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114819
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spelling my.utem.eprints.239922022-12-29T08:49:04Z http://eprints.utem.edu.my/id/eprint/23992/ Optimization of secondary bonding in layup process based on six sigma method Badaruddin, Nur Izayu T Technology (General) TA Engineering (General). Civil engineering (General) Composite manufacturing company is a company that produces parts for aeroplane which is made up of composite. Composite is the combination of more than one material to produce a strong part. One of the main problem of this part producing in the composite manufacturing company is recovering the panels once the panel have been scrapped. Besides that, this part have 6 days of lead time or manufacturing time for the parts. The top defect for this part is disbond. Disbond is a mismatching bonding of two parts to have one mutual part. The objectives of this study are to investigate the root cause for disbond defect in composite part by using six sigma analysis, to propose the solution for disbond defect in composite part, and to validate the effectiveness of the proposed solution for current production. In order to find the robust solution, six sigma analysis have been done. The six sigma analysis have five stages which are defined, measured, analyzed, improved and control phase. The proposed solutions can be identified in the analysed phase. The effectiveness of the solution can be defined in the improve phase. Not enough adhesive is the major root cause for disbond. The prefitting process require to define the number of adhesive added to the panel for bonding process. However, the method to define the number of adhesive is too subjective and have been discussed further in this study. 2018 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/23992/1/Optimization%20of%20Secondary%20Bonding%20in%20Layup%20Process%20Based%20on%20Six%20Sigma%20Method.pdf text en http://eprints.utem.edu.my/id/eprint/23992/2/Optimization%20of%20secondary%20bonding%20in%20layup%20process%20based%20on%20six%20sigma%20method.pdf Badaruddin, Nur Izayu (2018) Optimization of secondary bonding in layup process based on six sigma method. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114819
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
Badaruddin, Nur Izayu
Optimization of secondary bonding in layup process based on six sigma method
description Composite manufacturing company is a company that produces parts for aeroplane which is made up of composite. Composite is the combination of more than one material to produce a strong part. One of the main problem of this part producing in the composite manufacturing company is recovering the panels once the panel have been scrapped. Besides that, this part have 6 days of lead time or manufacturing time for the parts. The top defect for this part is disbond. Disbond is a mismatching bonding of two parts to have one mutual part. The objectives of this study are to investigate the root cause for disbond defect in composite part by using six sigma analysis, to propose the solution for disbond defect in composite part, and to validate the effectiveness of the proposed solution for current production. In order to find the robust solution, six sigma analysis have been done. The six sigma analysis have five stages which are defined, measured, analyzed, improved and control phase. The proposed solutions can be identified in the analysed phase. The effectiveness of the solution can be defined in the improve phase. Not enough adhesive is the major root cause for disbond. The prefitting process require to define the number of adhesive added to the panel for bonding process. However, the method to define the number of adhesive is too subjective and have been discussed further in this study.
format Thesis
author Badaruddin, Nur Izayu
author_facet Badaruddin, Nur Izayu
author_sort Badaruddin, Nur Izayu
title Optimization of secondary bonding in layup process based on six sigma method
title_short Optimization of secondary bonding in layup process based on six sigma method
title_full Optimization of secondary bonding in layup process based on six sigma method
title_fullStr Optimization of secondary bonding in layup process based on six sigma method
title_full_unstemmed Optimization of secondary bonding in layup process based on six sigma method
title_sort optimization of secondary bonding in layup process based on six sigma method
publishDate 2018
url http://eprints.utem.edu.my/id/eprint/23992/1/Optimization%20of%20Secondary%20Bonding%20in%20Layup%20Process%20Based%20on%20Six%20Sigma%20Method.pdf
http://eprints.utem.edu.my/id/eprint/23992/2/Optimization%20of%20secondary%20bonding%20in%20layup%20process%20based%20on%20six%20sigma%20method.pdf
http://eprints.utem.edu.my/id/eprint/23992/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114819
_version_ 1753792480466173952
score 13.211869