Optimization of secondary bonding in layup process based on six sigma method
Composite manufacturing company is a company that produces parts for aeroplane which is made up of composite. Composite is the combination of more than one material to produce a strong part. One of the main problem of this part producing in the composite manufacturing company is recovering the panel...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| اللغة: | English English |
| منشور في: |
2018
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/23992/1/Optimization%20of%20Secondary%20Bonding%20in%20Layup%20Process%20Based%20on%20Six%20Sigma%20Method.pdf http://eprints.utem.edu.my/id/eprint/23992/2/Optimization%20of%20secondary%20bonding%20in%20layup%20process%20based%20on%20six%20sigma%20method.pdf http://eprints.utem.edu.my/id/eprint/23992/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114819 |
| الوسوم: |
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| الملخص: | Composite manufacturing company is a company that produces parts for aeroplane which is made up of composite. Composite is the combination of more than one material to produce a strong part. One of the main problem of this part producing in the composite manufacturing company is recovering the panels once the panel have been scrapped. Besides that, this part have 6 days of lead time or manufacturing time for the parts. The top defect for this part is disbond. Disbond is a mismatching bonding of two parts to have one mutual part. The objectives of this study are to investigate the root cause for disbond defect in composite part by using six sigma analysis, to propose the solution for disbond defect in composite part, and to validate the effectiveness of the proposed solution for current production. In order to find the robust solution, six sigma analysis have been done. The six sigma analysis have five stages which are defined, measured, analyzed, improved and control phase. The proposed solutions can be identified in the analysed phase. The effectiveness of the solution can be defined in the improve phase. Not enough adhesive is the major root cause for disbond. The prefitting process require to define the number of adhesive added to the panel for bonding process. However, the method to define the number of adhesive is too subjective and have been discussed further in this study. |
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