Improvement of change glue schedule down time at lid attachment process for semiconductor devices
This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process...
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| Format: | Thesis |
| Language: | English English |
| Published: |
UTeM
2017
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf http://eprints.utem.edu.my/id/eprint/23785/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159 |
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http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdfhttp://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf
http://eprints.utem.edu.my/id/eprint/23785/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159