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Improvement of change glue schedule down time at lid attachment process for semiconductor devices

This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process...

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Bibliographic Details
Main Author: Abd Rahman, Rozeana
Format: Thesis
Language:English
English
Published: UTeM 2017
Subjects:
T Technology (General)
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf
http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf
http://eprints.utem.edu.my/id/eprint/23785/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159
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spelling my.utem.eprints.237852022-06-13T10:03:53Z http://eprints.utem.edu.my/id/eprint/23785/ Improvement of change glue schedule down time at lid attachment process for semiconductor devices Abd Rahman, Rozeana T Technology (General) TS Manufactures This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process is started with pick and places the lid onto the package, then proceeds to glue dispensing with dosage on four corners of the lids to completely seal the package by using capillary effect. There is a change of glue activity in this process which is counted under schedule down time. Based on the Overall Equipment Effectiveness (OEE), it was found that the change of glue activity give impact on the machine performance. The increasing of change glue time will result in the production did not achieve the target productivity. In this research, the hidden losses were defined on the equipment setup which is changed of glue in the lid attachment process. There is plan to increase the amount of glue lid attach to reduce the schedule down time in order to improve overall equipment effectiveness toward achieving good productivity. The study for glue pot life is required since increasing the amount of glue will extend the glue pot life and it is suspected will increase the glue viscosity. In general, all the project objective are managed to be achieved using the developed research methodology. For future work, this research should be enhance further to achieve better result and to make use of the increasing glue amount and pot life extended time enhancement in other perspective field and also to carry out further study to improve on the whitish on lid surface. UTeM 2017 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf text en http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf Abd Rahman, Rozeana (2017) Improvement of change glue schedule down time at lid attachment process for semiconductor devices. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159 TJ211.42.L64 2017
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TS Manufactures
spellingShingle T Technology (General)
TS Manufactures
Abd Rahman, Rozeana
Improvement of change glue schedule down time at lid attachment process for semiconductor devices
description This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process is started with pick and places the lid onto the package, then proceeds to glue dispensing with dosage on four corners of the lids to completely seal the package by using capillary effect. There is a change of glue activity in this process which is counted under schedule down time. Based on the Overall Equipment Effectiveness (OEE), it was found that the change of glue activity give impact on the machine performance. The increasing of change glue time will result in the production did not achieve the target productivity. In this research, the hidden losses were defined on the equipment setup which is changed of glue in the lid attachment process. There is plan to increase the amount of glue lid attach to reduce the schedule down time in order to improve overall equipment effectiveness toward achieving good productivity. The study for glue pot life is required since increasing the amount of glue will extend the glue pot life and it is suspected will increase the glue viscosity. In general, all the project objective are managed to be achieved using the developed research methodology. For future work, this research should be enhance further to achieve better result and to make use of the increasing glue amount and pot life extended time enhancement in other perspective field and also to carry out further study to improve on the whitish on lid surface.
format Thesis
author Abd Rahman, Rozeana
author_facet Abd Rahman, Rozeana
author_sort Abd Rahman, Rozeana
title Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_short Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_full Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_fullStr Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_full_unstemmed Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_sort improvement of change glue schedule down time at lid attachment process for semiconductor devices
publisher UTeM
publishDate 2017
url http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf
http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf
http://eprints.utem.edu.my/id/eprint/23785/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159
_version_ 1735573399687659520
score 13.211869

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