Improvement of mold ability and wire sweep in semiconductor devices using DOE statistical approach
Molding, also known as encapsulation in semiconductor industry, is one of the main processes in semiconductor manufacturing. In semiconductor industry, encapsulation is usually done using transfer molding due to very high accuracy of transfer molding tooling and low cycle time of the molding proces...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2016
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| Online Access: | http://eprints.utem.edu.my/id/eprint/21111/1/Improvement%20Of%20Mold%20Ability%20And%20Wire%20Sweep%20In%20Semiconductor%20Devices%20Using%20DOE%20Statistical%20Approach.pdf http://eprints.utem.edu.my/id/eprint/21111/2/Improvement%20of%20mold%20ability%20and%20wire%20sweep%20in%20semiconductor%20devices%20using%20DOE%20statistical%20approach.pdf http://eprints.utem.edu.my/id/eprint/21111/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104915 |
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