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Design and analysis of electrical testing probe for semiconductor integrated circuit

In the field of Test and Measurement in Semiconductor industry, where measuring small resistances are necessary on Semiconductor IC (Integrated Circuit). Nowadays given the fact that electronics gadgets are evaluated become more advanced, the size of the gadgets is getting smaller and smaller, and...

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Main Author: Wong, Michael Loke Peng
Format: Thesis
Language:English
English
Published: 2016
Subjects:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utem.edu.my/id/eprint/21105/1/Design%20And%20Analysis%20Of%20Electrical%20Testing%20Probe%20For%20Semiconductor%20Integrated%20Circuit.pdf
http://eprints.utem.edu.my/id/eprint/21105/2/Design%20and%20analysis%20of%20electrical%20testing%20probe%20for%20semiconductor%20integrated%20circuit.pdf
http://eprints.utem.edu.my/id/eprint/21105/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104917
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spelling my.utem.eprints.211052022-09-20T13:22:32Z http://eprints.utem.edu.my/id/eprint/21105/ Design and analysis of electrical testing probe for semiconductor integrated circuit Wong, Michael Loke Peng T Technology (General) TK Electrical engineering. Electronics Nuclear engineering In the field of Test and Measurement in Semiconductor industry, where measuring small resistances are necessary on Semiconductor IC (Integrated Circuit). Nowadays given the fact that electronics gadgets are evaluated become more advanced, the size of the gadgets is getting smaller and smaller, and getting cheaper in terms of price, this is a result of human kind is evaluating to advancement of electronics world. In this project, testing robe for Semiconductor IC was design to equip with self-sustaining scrubbing function, sustainable contact force and higher life span by Computer Aided Design (CAD). Then the most appropriate Testing Probe was selected by Analytical Hierarchy Process (AHP), which the pair-wise comparison matrix is constructed with the goal of Scrubbing function (SF), Contact force (CF), Low resistivity (LR), High current (HC), and Life span (LS). To analyze the designed Testing Probe for Semiconductor IC which fulfill the criteria, the test probe was undergo Finite Element Analysis (FEA) to determine the optimum Fatigue stress, Yield strength, maximum stress and displacement. Then the test probe was simulated under testing condition, data such as contact resistance CRES and displacement of test probe was collected until it reach its maximum life spend of 1.3 million touchdown. As result the most appropriate test probe was selected, which fulfilled all of the requirements. 2016 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/21105/1/Design%20And%20Analysis%20Of%20Electrical%20Testing%20Probe%20For%20Semiconductor%20Integrated%20Circuit.pdf text en http://eprints.utem.edu.my/id/eprint/21105/2/Design%20and%20analysis%20of%20electrical%20testing%20probe%20for%20semiconductor%20integrated%20circuit.pdf Wong, Michael Loke Peng (2016) Design and analysis of electrical testing probe for semiconductor integrated circuit. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104917
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
spellingShingle T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Wong, Michael Loke Peng
Design and analysis of electrical testing probe for semiconductor integrated circuit
description In the field of Test and Measurement in Semiconductor industry, where measuring small resistances are necessary on Semiconductor IC (Integrated Circuit). Nowadays given the fact that electronics gadgets are evaluated become more advanced, the size of the gadgets is getting smaller and smaller, and getting cheaper in terms of price, this is a result of human kind is evaluating to advancement of electronics world. In this project, testing robe for Semiconductor IC was design to equip with self-sustaining scrubbing function, sustainable contact force and higher life span by Computer Aided Design (CAD). Then the most appropriate Testing Probe was selected by Analytical Hierarchy Process (AHP), which the pair-wise comparison matrix is constructed with the goal of Scrubbing function (SF), Contact force (CF), Low resistivity (LR), High current (HC), and Life span (LS). To analyze the designed Testing Probe for Semiconductor IC which fulfill the criteria, the test probe was undergo Finite Element Analysis (FEA) to determine the optimum Fatigue stress, Yield strength, maximum stress and displacement. Then the test probe was simulated under testing condition, data such as contact resistance CRES and displacement of test probe was collected until it reach its maximum life spend of 1.3 million touchdown. As result the most appropriate test probe was selected, which fulfilled all of the requirements.
format Thesis
author Wong, Michael Loke Peng
author_facet Wong, Michael Loke Peng
author_sort Wong, Michael Loke Peng
title Design and analysis of electrical testing probe for semiconductor integrated circuit
title_short Design and analysis of electrical testing probe for semiconductor integrated circuit
title_full Design and analysis of electrical testing probe for semiconductor integrated circuit
title_fullStr Design and analysis of electrical testing probe for semiconductor integrated circuit
title_full_unstemmed Design and analysis of electrical testing probe for semiconductor integrated circuit
title_sort design and analysis of electrical testing probe for semiconductor integrated circuit
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/21105/1/Design%20And%20Analysis%20Of%20Electrical%20Testing%20Probe%20For%20Semiconductor%20Integrated%20Circuit.pdf
http://eprints.utem.edu.my/id/eprint/21105/2/Design%20and%20analysis%20of%20electrical%20testing%20probe%20for%20semiconductor%20integrated%20circuit.pdf
http://eprints.utem.edu.my/id/eprint/21105/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104917
_version_ 1744651978400595968
score 13.211869

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