To eliminate icing and condensation in temperature cycling chambers

In reliability testing,the temperature cycle chamber is one of the most common pieces of equipment needed to assess semiconductor devices reliability.Temperature cycling involves subjecting the semiconductor devices to an environment test to hot and cold temperature cyclic transition.In a temperatur...

詳細記述

保存先:
書誌詳細
第一著者: Ramalingam, Premnathan
フォーマット: 学位論文
言語:English
English
出版事項: 2017
主題:
オンライン・アクセス:http://eprints.utem.edu.my/id/eprint/20991/1/To%20eliminate%20icing%20and%20condensation%20in%20temperature%20cycling%20chambers.pdf
http://eprints.utem.edu.my/id/eprint/20991/2/To%20eliminate%20icing%20and%20condensation%20in%20temperature%20cycling%20chambers.pdf
http://eprints.utem.edu.my/id/eprint/20991/
http://library1.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000105470
タグ: タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!

類似資料