To eliminate icing and condensation in temperature cycling chambers
In reliability testing,the temperature cycle chamber is one of the most common pieces of equipment needed to assess semiconductor devices reliability.Temperature cycling involves subjecting the semiconductor devices to an environment test to hot and cold temperature cyclic transition.In a temperatur...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2017
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/20991/1/To%20eliminate%20icing%20and%20condensation%20in%20temperature%20cycling%20chambers.pdf http://eprints.utem.edu.my/id/eprint/20991/2/To%20eliminate%20icing%20and%20condensation%20in%20temperature%20cycling%20chambers.pdf http://eprints.utem.edu.my/id/eprint/20991/ http://library1.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000105470 |
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http://eprints.utem.edu.my/id/eprint/20991/1/To%20eliminate%20icing%20and%20condensation%20in%20temperature%20cycling%20chambers.pdfhttp://eprints.utem.edu.my/id/eprint/20991/2/To%20eliminate%20icing%20and%20condensation%20in%20temperature%20cycling%20chambers.pdf
http://eprints.utem.edu.my/id/eprint/20991/
http://library1.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000105470