Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip
Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf http://eprints.utem.edu.my/id/eprint/20186/ |
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