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Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip

Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...

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Bibliographic Details
Main Authors: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia
Format: Conference or Workshop Item
Language:English
Published: 2012
Subjects:
T Technology (General)
TA Engineering (General). Civil engineering (General)
Online Access:http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf
http://eprints.utem.edu.my/id/eprint/20186/
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http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf
http://eprints.utem.edu.my/id/eprint/20186/

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