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Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration

Current thermosonic flip chip bonding technologies are adversely affected by chip-to-substrate co-planarity errors and bump/pad height variations which can lead to uneven bonding strength and, in extreme cases, chip cratering. This has limited the industrial uptake of thermosonic flip chip assembly....

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Main Author: Nordin, Mohd Hisham
Format: Thesis
Language:English
Published: UTeM 2016
Subjects:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utem.edu.my/id/eprint/18846/1/Flip-Chip%20Bonding%20Using%20Laser%20Induced%20Ultrasonic%20Vibration%2024%20Pages.pdf
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spelling my.utem.eprints.188462017-07-31T00:57:48Z http://eprints.utem.edu.my/id/eprint/18846/ Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration Nordin, Mohd Hisham T Technology (General) TK Electrical engineering. Electronics Nuclear engineering Current thermosonic flip chip bonding technologies are adversely affected by chip-to-substrate co-planarity errors and bump/pad height variations which can lead to uneven bonding strength and, in extreme cases, chip cratering. This has limited the industrial uptake of thermosonic flip chip assembly. The aim of the research reported here was to explore the use of laser-generated ultrasound as an alternative ultrasound source in flip chip bonding. The research was motivated by the idea that, with greater control over the distribution of ultrasonic energy applied over the bonding interface, it should be possible to compensate for and mitigate the above effects. The main objective of this research work was to establish a working flip-chip bonding process using laser induced ultrasonic vibration. Initially, a literature review on current flip-chip bonding methods and laser ultrasonic methods was carried out. This suggested that confined laser ablation would be the most appropriate technique for generating strong ultrasonic vibration. Next, through modelling and simulation, an investigation was carried out to determine the suitable parameters and methods to be implemented during the experimental stage, including the pressure pulse amplitude, cavity width (irradiance spot size) and type of sacrificial material. Additional investigations were also carried out to explore the effect of applying different materials in generating ultrasonic vibration and also to show the effect of applying multiple pressure pulses simultaneously. In the experimental phase, a custom bonding rig was developed and used to explore the parameter space for thermosonic bonding on polymer substrates using ultrasound generated by a diode-pumped solid-state laser (355 nm wavelength). Initial experiments showed unstable bond strength due to the accumulation of heat which resulted in the appearance of an unwanted glue-like substance at the bonding interface. However, this issue was overcome through careful choice of process parameters combined with the introduction of off-axis laser irradiation. A process for bonding dummy test chips to flexible substrates was successfully established, and in the best case a die shear strength of 9.3 gf/bump was achieved. UTeM 2016 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/18846/1/Flip-Chip%20Bonding%20Using%20Laser%20Induced%20Ultrasonic%20Vibration%2024%20Pages.pdf Nordin, Mohd Hisham (2016) Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration. PhD thesis, Universiti Teknikal Malaysia Melaka. http://library.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000102296 HF5351.M34 2016
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
spellingShingle T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
Nordin, Mohd Hisham
Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
description Current thermosonic flip chip bonding technologies are adversely affected by chip-to-substrate co-planarity errors and bump/pad height variations which can lead to uneven bonding strength and, in extreme cases, chip cratering. This has limited the industrial uptake of thermosonic flip chip assembly. The aim of the research reported here was to explore the use of laser-generated ultrasound as an alternative ultrasound source in flip chip bonding. The research was motivated by the idea that, with greater control over the distribution of ultrasonic energy applied over the bonding interface, it should be possible to compensate for and mitigate the above effects. The main objective of this research work was to establish a working flip-chip bonding process using laser induced ultrasonic vibration. Initially, a literature review on current flip-chip bonding methods and laser ultrasonic methods was carried out. This suggested that confined laser ablation would be the most appropriate technique for generating strong ultrasonic vibration. Next, through modelling and simulation, an investigation was carried out to determine the suitable parameters and methods to be implemented during the experimental stage, including the pressure pulse amplitude, cavity width (irradiance spot size) and type of sacrificial material. Additional investigations were also carried out to explore the effect of applying different materials in generating ultrasonic vibration and also to show the effect of applying multiple pressure pulses simultaneously. In the experimental phase, a custom bonding rig was developed and used to explore the parameter space for thermosonic bonding on polymer substrates using ultrasound generated by a diode-pumped solid-state laser (355 nm wavelength). Initial experiments showed unstable bond strength due to the accumulation of heat which resulted in the appearance of an unwanted glue-like substance at the bonding interface. However, this issue was overcome through careful choice of process parameters combined with the introduction of off-axis laser irradiation. A process for bonding dummy test chips to flexible substrates was successfully established, and in the best case a die shear strength of 9.3 gf/bump was achieved.
format Thesis
author Nordin, Mohd Hisham
author_facet Nordin, Mohd Hisham
author_sort Nordin, Mohd Hisham
title Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
title_short Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
title_full Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
title_fullStr Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
title_full_unstemmed Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
title_sort flip-chip bonding using laser induced ultrasonic vibration
publisher UTeM
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/18846/1/Flip-Chip%20Bonding%20Using%20Laser%20Induced%20Ultrasonic%20Vibration%2024%20Pages.pdf
http://eprints.utem.edu.my/id/eprint/18846/
http://library.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000102296
_version_ 1665905723553349632
score 13.223943

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