XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip
Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2013
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| Online Access: | http://eprints.utem.edu.my/id/eprint/10252/1/24_AMR_620.pdf http://eprints.utem.edu.my/id/eprint/10252/ http://www.scientific.net |
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